The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Latest Conference Proceedings Now Available in SMTA Knowledge Base
February 8, 2019 | SMTAEstimated reading time: 1 minute
The 2018 Technical Conference Proceedings from the SMTA International Conference and Exhibition (SMTAI) and International Wafer-Level Packaging Conference (IWLPC) are now available for download from the SMTA Knowledge Base.
"This is your source for the latest and highest quality information and research on electronics manufacturing and advanced packaging," stated Ryan Flaherty, SMTA director of communications, in making the announcement. “You can download more than 100 papers that were presented in the technical sessions last fall at SMTA International, and over 30 papers from IWLPC.”
Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.
The SMTA International Conference and Exhibition (SMTAI) 2019 will be held September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois, USA.
The next International Wafer-Level Packaging Conference will be held on October 22-24, 2019 at the DoubleTree by Hilton San Jose in San Jose, CA, USA.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Suggested Items
Kimball Electronics Thailand Namlee School
12/26/2024 | Kimball ElectronicsKimball Electronics Thailand (KETL) has continued its commitment to supporting education and community development in Thailand.
Diverging Electrification Goals between Honda and Nissan; Accelerated Resource Integration will be the Top Priority Post-Merger
12/25/2024 | TrendForceHonda and Nissan—two of Japan’s largest automakers—announced on December 23rd, 2024, that they have entered into merger negotiations, with plans to finalize an agreement by June 2025. Mitsubishi Motors is also expected to join the partnership.
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas InstrumentsTexas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024.
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.