-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Volunteers Honored for Contributions to IPC and the Electronics Industry
February 11, 2019 | IPCEstimated reading time: 3 minutes
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on January 28 and January 30 at IPC APEX EXPO 2019 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Receiving Special Recognition Awards for their contributions to the 2018-2019 Technical Program Committee were Steve Butkovich, Test Innovation, LLC; Weifeng Liu, Flex; Russ Nowland, Nokia; Julie Silk, Keysight Technologies; and Bhanu Sood, NASA Goddard Space Flight Center.
For his leadership of the 8-81 PERM Self-Mitigation of Tin by SMT Task Group that developed IPC/PERM-WP-022, Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow, David Pinsky, Raytheon Company, received a Committee Leadership Award. Ben Gumpert, Lockheed Martin Missiles & Fire Control; Thomas Hester, Raytheon Space and Airborne Systems; David Hillman, Collins Aerospace; Anduin Touw, The Boeing Company; Ross Wilcoxon, Collins Aerospace; and Paul Zutter, U.S. Army AMRDEC, received a Distinguished Committee Service Award.
For their leadership of the 7-31FT IPC/WHMA-A-620 Technical Training Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Catherine Hanlin, Prevision Manufacturing Company, Inc; Shelley Holt, L3 Communications; and Debbie Wade, Advanced Rework Technology-A.R.T, earned a Committee Leadership Award. For their extraordinary contributions to IPC/WHMA-A-620C, Garry Maguire, NASA Marshall Space Flight Center; Michelle Morring, STI Electronics Inc; and Pat Scott, STI Electronics Inc, received a Special Recognition Award.
Symon Franklin, Custom Interconnect Ltd. And Debbie Wade, Advanced Rework Technology-A.R.T, were honored with Committee Leadership Awards for their leadership of the 5-22BTEU European Technical Training Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies.
For his leadership of the D-33AA IPC-6012 Automotive Addendum Task Group that developed IPC-6012DA, Automotive Applications Addendum to IPC-6012D, with Amendment 1, Qualification and Performance Specification for Rigid Printed Boards, Jan Pedersen, Elmatica, earned a Committee Leadership Award. For their extraordinary contributions, Kelvin Chang, Veoneer Canada Inc.; Nancy Deng, Ford Motor Research & Engineering; Emma Hudson, Gen3 Systems Limited; Andrew Goddard, ZF TRW Automotive; Todd MacFadden; Bose Corporation; Laurent Nardo, Continental Automotive France SAS; Michael Schoening, Q-Products Enterprise Limited; and Udo Welzel, Robert Bosch Co. Ltd., received a Special Recognition Award.
For their leadership of the 5-22a J-STD-001 Task Group that developed J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1, Dan Foster, Missile Defense Agency, and Kathy Johnston, Raytheon Missile Systems, earned a Committee Leadership award. Doug Pauls, Collins Aerospace, and Udo Welzel, Robert Bosch GmBH, received a Committee Leadership Award for their leadership of the Rhino Team that developed IPC-WP-019A, An Overview on the Global Change in Ionic Cleanliness Requirements/ J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1.
Dock Brown, DfR Solutions; Karen McConnell, Northrop Grumman Corporation; and Steve Golemme, Google Inc., were honored with a Committee Leadership Award for leading the 1-14 DFX Standards Subcommittee that developed IPC-2231, Design for Excellence Guideline during the Product Lifecycle. Don Dupriest, Lockheed Martin Missiles & Fire Control, received a Special Recognition Award. Jimmy Baccam, Lockheed Martin Missiles & Fire Control; Benny Barbero, Allied Telesis Inc; Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati; Peter Fernandez, Lab 126; Michelle Gleason, Plexus Corp.- Neenah Operations; Kayleen Helms, Intel Corporation; Eddie Hofer, Rockwell Collins; Waleid Jabai, Zentech Manufacturing; Kevin Kusiak, Lockheed Martin Space Systems Company; Dale Lee, Plexus Corp.- Neenah Operations; Kristopher Moyer, CSUS; James Pierce, Axiom Electronics, LLC; Robert Rowland, Axiom Electronics, LLC; Steven Roy, Hamilton Company; Rainer Taube, Taube Electronic GmbH; Theodore John Tontis, Rockwell Automation/Allen-Bradley; Cheryl Tulkoff, DfR Solutions; Louis Ungar, Advanced Test Engineering Solutions, Inc.; Pietro Vergine, Leading Edge; and Linda Woody, LWC Consulting, received a Distinguished Committee Service Award for their contributions to IPC-2231, Design for Excellence Guideline during the Product Lifecycle.
Suggested Items
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.