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Indium Features Unique Metal Thermal Interface Materials at Semi-Therm 2019
February 12, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its unique solid/liquid hybrid metal thermal interface materials — m2TIM — during the Semi-Therm 35th Annual Symposium & Exhibit, March 18-22, San Jose, California, USA.
Indium Corporation’s m2TIM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.
Available in InGa and InGaSn, this m2TIM hybrid approach provides extraordinary wetting ability to both metallic and non-metallic surfaces and low interfacial resistance. It also eliminates the risk of pump-out of the liquid alloy.
Presentations and posters will be available at the show to give you more in-depth information about this unique product. Please visit Indium Corporation at booth #405 to talk with their experts.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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