-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
STI Electronics Sponsors SMTA Pan Pacific Microelectronics Symposium
February 13, 2019 | STI ElectronicsEstimated reading time: 1 minute
STI Electronics, Inc. is pleased to announce that it is a corporate sponsor of the 2019 SMTA Pan Pacific (Pan Pac) Microelectronics Symposium. The event is scheduled to take place Feb. 11-14, 2019 at the Kauai Marriott Resort & Beach Club in Kauai, Hawaii.
STI Electronics has been a corporate member and supporter of the SMTA for more than 27 years. Many of its employees are active in the local chapters as well. An active IPC and SMTA member, STI President David Raby served two terms as president and two terms on the board of directors for SMTA.
“STI is proud to provide corporate sponsorship for this year’s Pan Pac symposium,” said David Raby, President/CEO. “The beautiful venue combined with a more intimate setting provides attendees with a great opportunity to gain knowledge in the electronics manufacturing industry.”
Pan Pac promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
In addition to several inspiring keynotes, the event will feature ground-breaking research from global experts on advanced packaging & processes, automotive systems & hardware, cleaning technologies, heterogeneous integration, inspection & test techniques, interposer & packaging technology, materials & reliability, nanotechnology applications and more.
With some of the most advanced equipment for training, R&D, contract manufacturing and material analysis, STI engineers and analysts have the versatility to provide the highest quality services for a wide range of products and services. STI has the capability to address the toughest challenges and issues facing today's electronic manufacturers.
About STI Electronics, Inc.
Since 1982, STI Electronics, Inc. (STI) has been the premier full-service organization for training, consulting, laboratory analysis, prototyping, and contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.