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TopLine to Exhibit CCGA, Solder Joint Reliability Solutions at Electronica China and Semicon China
February 27, 2019 | TopLineEstimated reading time: 1 minute
TopLine will exhibit its innovative CCGA solutions at the upcoming Electronica China and Semicon China (co-located) March 20-22, 2019, at the Shanghai New International Expo Center. TopLine is a world-leading manufacturer and designer of component solutions and test vehicles for SMT/PCB assembly.
Featured products will include CCGA - Column Grid Arrays and daisy chain BGA test vehicles. ”There is growing Interest in CCGA Column Grid Array packages in China,” states Martin Hart, TopLine’s CEO. “It's about reliability. PCBA manufacturers are selecting CCGA packages because of the CCGA's ability to reduce stress directly caused by CTE mismatch.”
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible high-temperature solder columns for Surface Mount (SMT) soldering on Printed Circuit Boards (PCBs). CCGA packages provide more compliancy than BGA solder balls (Ball Grid Arrays) to absorb stress caused by CTE mismatch and increase solder joint reliability under harsh operating conditions.
TopLine has been active in promoting its products in the China market for more than 20 years.
About TopLine
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
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