Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
TopLine to Exhibit CCGA, Solder Joint Reliability Solutions at Electronica China and Semicon China
February 27, 2019 | TopLineEstimated reading time: 1 minute
TopLine will exhibit its innovative CCGA solutions at the upcoming Electronica China and Semicon China (co-located) March 20-22, 2019, at the Shanghai New International Expo Center. TopLine is a world-leading manufacturer and designer of component solutions and test vehicles for SMT/PCB assembly.
Featured products will include CCGA - Column Grid Arrays and daisy chain BGA test vehicles. ”There is growing Interest in CCGA Column Grid Array packages in China,” states Martin Hart, TopLine’s CEO. “It's about reliability. PCBA manufacturers are selecting CCGA packages because of the CCGA's ability to reduce stress directly caused by CTE mismatch.”
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible high-temperature solder columns for Surface Mount (SMT) soldering on Printed Circuit Boards (PCBs). CCGA packages provide more compliancy than BGA solder balls (Ball Grid Arrays) to absorb stress caused by CTE mismatch and increase solder joint reliability under harsh operating conditions.
TopLine has been active in promoting its products in the China market for more than 20 years.
About TopLine
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Share on:
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.