It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Ventec at APEC 2019: Thermal Management and IMS Solutions for Power Electronics
March 6, 2019 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group will showcase its latest power electronics PCB material technology innovations at APEC 2019, which is taking place at the Anaheim Convention Center from March 18-20 in Anaheim, California, USA. The Ventec technology team will be on hand on booth #438 showcasing unique laminate & prepreg capability solutions designed for the most demanding thermal applications.
Ventec is set to further strengthen its position as a global leader in technology for high-performance thermal management and signal integrity materials at the Applied Power Electronics Conference in Anaheim, USA on booth #438.
Show highlights include:
VT-4B Series IMS – thermal conductivity from 1.0 to 10.0 W/m.K
For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming with thermal conductivity of 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance: 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications including high power-density converters and power supplies. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.
VT-5A2—Highest performance thermally conductive laminate material
The perfect choice for hybrid multilayer low-loss constructions, VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed. The lead-free assembly compatible material sets itself apart by offering highest performance thermal conductivity 8 times that of FR-4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 minutes, T288 >30 minutes and T300 >15 minutes) and MOT of 130°C.
tec-speed 20.0—No more compromises—performance, price & availability
Power amplifiers are one of the world's most demanding printed circuit board applications where high frequency performance, loss characteristics and reliability are key. tec-speed 20.0 (VT-870) offers all three and more: unrivalled performance with Dk 3.00-3.48 and Df 0.002-0.0037, superior loss characteristics and highest reliability, combined with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.
Thermal Interface Materials
As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, EMI Thermal’s thermal interface materials (TIM) will be presented on the booth. The range of materials distributed through Ventec includes double-sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.
About Ventec International Group
Ventec International is a premier supplier to the global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.