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The National Physical Laboratory’s (NPL) Electronics Interconnection Group is internationally recognized for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. The team investigates interconnect properties and develop metrological techniques to characterize performance, frequently in multiple domains.
A new webinar on organic hybrids for circuit assemblies—initial environmental testing of a low-cost alternative to ceramic substrate-based assemblies, highlights earlier work undertaken by the authors and partners to understand the deficiencies of copper-clad PCB technology and details work to develop a low-cost alternative to ceramic substrate-based assemblies.
The webinar will be held on March 19, 2019, at 14:30 UTC. For more information or to register, click here.
