SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Indium to Feature Void-reducing Solder Paste at SMTconnect 2019
March 7, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void at SMTconnect, May 7-9, in Nuremberg, Germany.
The Indium8.9HF series is a proven product that delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus enhanced electrical reliability and improved stability—during the printing process. Under optimal process conditions, this series:
- Exceeds all requirements for enhanced electrical reliability and SIR performance
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- Resists premature flux spread to prevent surfaces from oxidizing
- Performs with both Pb and Pb-free alloys
The Indium8.9HF Solder Paste series provides a unique oxidation barrier technology that eliminates HIP defects and graping, making them perfectly suited for automotive assembly and a variety of electronics assembly applications. In fact, the product meets HKMC MS184-01 testing criteria Type B, one of the toughest automotive criteria to ensure reliability.
For information on how Indium8.9HF can help you Avoid the Void, visit Indium Corporation in hall 5, booth 310.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.