-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SEHO Brings the LeanSelect and GoWave to ElectronTechExpo
March 7, 2019 | SEHO Systems GmbHEstimated reading time: 1 minute

SEHO Systems GmbH will exhibit at the ElectronTechExpo, scheduled to take place April 15-17, 2019 in Moscow, Russia. SEHO’s representative Global Engineering will display the LeanSelect and GoWave in Pavilion 3, Hall 13, Booth # B535.
Electronic productions face new manufacturing challenges more and more frequently. In addition to high quality requirements at low production costs, there are an increasing number of product variants and flexible reactions to fluctuation in demand. The SEHO LeanSelect is particularly designed to meet these challenges, featuring the highest flexibility and outstanding return on investment.
The work stations of the LeanSelect are arranged in a counter-clockwise U-shape, thus consistently following the Lean Equipment Design Guidelines. While the entire process is fully automated, loading and unloading of assemblies is done manually on two separate conveyors. This allows processing of up to five carriers at the same time, ensuring highest productivity on a small footprint of only 2.5 m².
Provided with an electro-magnetic soldering unit, the system guarantees perfect and reproducible soldering results. Depending on the application, the LeanSelect can be used for both, flexible miniwave processes and product-specific multiwave soldering processes with high throughput. Quickly exchangeable solder nozzles and multi-nozzle tools ensure short change-over times.
The automatic ultrasonic cleaning function for nozzles is a particular highlight of the system and ensures maximum machine availability. Besides significantly longer lifetime of the solder nozzles, this unique feature provides an absolutely stable soldering process.
Sensors and software tools continuously monitor all process steps, thus providing 100 % automated process control. Depending on the application, even a PowerVision AOI system can be integrated, for solder joint inspection immediately after the soldering process.
The GoWave wave soldering system is a powerful soldering system for those just entering into mass-soldering operations. The system is suited for electronic productions with small or medium-sized volumes and also provides an economic solution for universities, schools and laboratories.
A special feature of this machine is its compact, but performance-oriented design. It therefore allows an economical, automatic wave soldering process at simultaneously low costs.
The design of the GoWave provides the same basic technology found in SEHO’s large wave soldering machines. Offering a fluxing module, an efficient and powerful preheater, an innovative soldering area and an up-to-date control, this system presents the finest soldering technology in its class.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.