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October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

U.S AEP Success Rides on Navigating Three Key Market Trends

10/16/2026 | Nolan Johnson, I-Connect007
The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.

From Resilience to AI Infrastructure: Key Insights from 2026 Electronics Day EMS Europe

10/13/2026 | Anastasia Ederer, Global Electronics Association
On Sept. 17, the 2026 Electronics Day EMS Europe brought together executives, manufacturers, policymakers, and industry experts for a full day of discussion on the challenges and opportunities facing Europe’s electronics ecosystem. Across four sessions, the conversation spanned the electronics value chain. It began with European resilience and competitiveness, moved into the latest EMS market outlook, examined the infrastructure behind the rapid expansion of AI, and concluded with the growing pressures affecting PCB materials and manufacturing capacity.

SCHMID Pushes Toward the Submicron

10/07/2026 | Marcy LaRont, I-Connect007 Magazine
Fabricators are confronting process requirements today that would have seemed foreign to the PCB shop not long ago, presenting both a promise and a significant manufacturing challenge. SCHMID is one company rising to it in big ways. SCHMID's Laurent Nicolet, VP for the Business Unit PCB, talks about the convergence between PCB fabrication and semiconductor processing as feature sizes shrink, the emergence of glass as an attractive substrate and interposer material, and SCHMID’S embedded trace technology and the work toward moving that technology into high-volume manufacturing.

October SMT007 Magazine Examines Automotive Soldering Reliability

10/01/2026 | I-Connect007 Editorial Team
The October 2026 issue of SMT007 Magazine is now available. As automakers add more electronics while maintaining high production volumes, the stakes for reliable electronics assembly continue to rise. Every added board, sensor, and control system must perform consistently under demanding conditions.
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