Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Last Call for Papers for EIPC Summer Conference Leoben 2019
March 12, 2019 | EIPCEstimated reading time: Less than a minute
The deadline for the submission of abstracts of papers for presentation at the EIPC Summer Conference Leoben 2019 is on March 18.
For those interested to present at the Summer Conference, which will be held on June 13–14, click here for the abstract submission form.
Share on:
Suggested Items
Rules of Thumb: Design007 Magazine, November 2024
11/11/2024 | I-Connect007 Editorial TeamRules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. They’re built on design formulas, fabricators’ limitations, and tribal knowledge. And unfortunately, some longtime rules of thumb should be avoided at all costs. How do we separate the wheat from the chaff, so to speak?
Connect the Dots: Best Practices for Prototyping
09/21/2023 | Matt Stevenson -- Column: Connect the DotsPCB prototyping is a critical juncture during an electronic device’s journey from concept to reality. Regardless of a project’s complexity, the process of transforming a design into a working board is often enlightening in terms of how a design can be improved before a PCB is ready for full production.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Asia/Pacific AI Spending Surge to Reach a Projected $78 Billion by 2027
09/19/2023 | IDCAsia/Pacific spending on Artificial Intelligence (AI) ), including software, services, and hardware for AI-centric systems will grow to $78.4 billion in 2027, according to International Data Corporation's latest Worldwide Artificial Intelligence Spending Guide.
Intel to Sell Minority Stake in IMS Nanofabrication Business to TSMC
09/13/2023 | IntelIntel Corporation announced that it has agreed to sell an approximately 10% stake in the IMS Nanofabrication business to TSMC. TSMC’s investment values IMS at approximately $4.3 billion, consistent with the valuation of the recent stake sale to Bain Capital Special Situations.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in