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Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
YINCAE Advanced Materials will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, Massachusetts. Additionally, Dr. Wusheng Yin, president of YINCAE, will be giving a presentation on our unique product, zero outgassing and flux residue-compatible underfill.
One of the most essential and difficult aspects of wafer level integration is the requirement for zero outgassing during the underfill curing process. This step is crucial as outgassing can contaminate neighboring components. Additionally, cleaning flux residue is also becoming more difficult as electrical components across all industries are increasing in density and miniaturization. In particular, the automotive industry is growing rapidly in its need for underfills as they can be used to enhance mechanic strength and to absorb stress from CTE mismatch.
In response to this growing need, YINCAE has successfully developed a zero outgassing, flux residue-compatible underfill, the SMT 158HA. This underfill does not require the cleaning of flux residue and has repeatedly demonstrated zero outgassing during the curing process. After curing, the electronic device can pass a 5x 260°C reflow process.
About YINCAE Advanced Materials
Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
