-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Launches Die Attach, Low-Temp and Adhesive Solutions at productronica China
March 14, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions will be exhibiting at the productronica China show to be held at the Shanghai New International Expo Centre in Shanghai from March 20-22.
MacDermid Alpha’s Assembly division will be highlighting silver sintering technology, low temperature technology and epoxy technology at the productronica China show. ¨ALPHA Argomax silver sinter products provide a dramatic reduction in thermal resistance and inductance as well as delivering an order of magnitude increase in reliability, 30x higher than traditional solder methods,“ said Julien Joguet, global business market manager, Die Attach at MacDermid Alpha. ¨The products also result in the lowest dollars per kilowatt for both silicon and wide bandgap devices with high voltages and high operating temperatures.“
“The ALPHA HRL1 alloy was designed to enable near-SAC305 drop shock and improved thermal cycling performance in low temperature assemblies”, said Phua Teo Leng, global portfolio manager for SMT Assembly Solutions at MacDermid Alpha. “This chemistry and alloy pairing is revolutionary as it reduces the soldering temperature required for SAC alloys by 50°C, while dramatically reducing power consumption and carbon emissions. Assemblers can now benefit from having a cost efficient, highly reliable soldering process with up to 99% less warpage and significantly fewer defects, which is truly unique.”
For providing a full range of electronics assembly polymers products, Alpha acquired Hi-Tech Korea Co., Ltd, a premier electronics assembly polymer and epoxy-based materials supplier last year. “Alpha is now able to serve the global electronics assembly market with new product offerings of epoxy materials under the brand name ALPHA HiTech.” said Jimmy Shu, marketing director for the Assembly division in Asia-Pacific. These products are underfill, cornerfill, encapsulants, low temperature adhesives, UV adhesives and SMD adhesives for the mobile, camera modules, automotive, LED, consumer goods and industrial markets.
Semiconductor Division will focus on their complete line of formulations for semiconductor metallization, wafer interconnect and packaging, while Circuitry Division will focus on full portfolio of PCB’s processes, including PTH and microvia metallization, copper electroplating, solderable finishes and flex circuitry, offering a comprehensive approach in the expertise development of chemical solutions forming printed circuit pathways.
For additional information about MacDermid Alpha's latest technologies and products, please visit Booth #E2-2600 at productronica China.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.