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NVIDIA’s AI Rack Transition Accelerates; NVL72 Output Value to Exceed $710 Billion in 2027

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Decoding the CMMC Suspension

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Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

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A Practical Approach to Material Selection for High Power PCBs

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With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.
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