-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Conecsus Presents SMT Metals Waste Recycling Solutions at Upcoming SMTA Chihuahua Expo
March 21, 2019 | Conecsus, LLCEstimated reading time: 1 minute

Conecsus, LLC, an innovative environmental technology and recycling company, will exhibit at the SMTA Expo and Tech Forum Chihuahua Edition, Wednesday, May 8, 2019 beginning at 09:00 a.m. The venue is Salon Villarreal, Colegio, Lomas del Valle, Chihuahua, Chih., Mexico.
Local representatives Roberto G Valenzuela Camargo, Laura Robleto, and Yessica Romero will be in the booth, and will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market. Conecsus recently won a coveted Mexico Technology Award for its unique and innovative metals waste and dross recycling technologies.
With patented, advanced recycling technologies, Conecsus keeps its customers compliant with local, state, and federal regulations while decreasing their carbon footprint and reportable waste streams. Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products.
About Conecsus
Founded in 1980, Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Tin-Zinc, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Located in Terrell, Texas, USA, Conecsus converts these wastes into usable metal products. Conecsus’ mission is to provide innovative and high-quality industrial byproducts management, metal recovery, and recycling options that provide world-class value and service to our customers, and display respect and stewardship toward the environment.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.