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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Firstronic Adds Two New Industrial Customers
March 28, 2019 | Firstronic LLCEstimated reading time: 1 minute
Firstronic has been awarded an industrial LED lighting project that involves three power supplies each comprised of a two-PCBA set, potting and a housing. It will represent $1.5 million in annualized revenue initially, with plans to transition to complete box build/system integration as soon as practical, representing $5-6 million annually. The project ramps in the third quarter of the year in the Juarez, Mexico facility and qualifications are currently underway.
“The customer was impressed with our previous LED experience. They are doing a lot of business in Asia, but wanted a cost competitive North American footprint as well,” said Kurt Rich, Firstronic’s business development manager.
The second project is a PCBA-level industrial control product, comprised of several product families. It is anticipated to represent approximately $4 million in annualized revenue initially, with plans to increase significantly over the next year as Firstronic transitions the production of additional products. It is mixed technology (SMT/PTH). Qualification runs will start in the second quarter in the Juarez facility.
“Because this project involves mixed technology, the customer was very interested in our EPM wave solder machine, which can do multiple board types simultaneously, switching profiles as it reads PCBA bar codes. They also like our quality culture and focus on in-plant performance metrics,” said Rich.
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.