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Firstronic Adds Two New Industrial Customers
March 28, 2019 | Firstronic LLCEstimated reading time: 1 minute
Firstronic has been awarded an industrial LED lighting project that involves three power supplies each comprised of a two-PCBA set, potting and a housing. It will represent $1.5 million in annualized revenue initially, with plans to transition to complete box build/system integration as soon as practical, representing $5-6 million annually. The project ramps in the third quarter of the year in the Juarez, Mexico facility and qualifications are currently underway.
“The customer was impressed with our previous LED experience. They are doing a lot of business in Asia, but wanted a cost competitive North American footprint as well,” said Kurt Rich, Firstronic’s business development manager.
The second project is a PCBA-level industrial control product, comprised of several product families. It is anticipated to represent approximately $4 million in annualized revenue initially, with plans to increase significantly over the next year as Firstronic transitions the production of additional products. It is mixed technology (SMT/PTH). Qualification runs will start in the second quarter in the Juarez facility.
“Because this project involves mixed technology, the customer was very interested in our EPM wave solder machine, which can do multiple board types simultaneously, switching profiles as it reads PCBA bar codes. They also like our quality culture and focus on in-plant performance metrics,” said Rich.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.