Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Murray Percival Company to Exhibit at West Penn Expo
March 28, 2019 | Murray Percival CompanyEstimated reading time: Less than a minute
Murray Percival Company, the leading supplier to the Midwest's electronics industry, today announced plans to exhibit in booth #9 at the West Penn Expo & Tech Forum, scheduled to take place April 2, 2019 at the DoubleTree Monroeville in Monroeville, Pennsylvania.
Murray Percival Company will be attending in order to support some of their leading vendors including:
- SCHUNK, the industry’s leading supplier of routing systems.
- Cluso, top provider of SMT reel storage solutions.
- Alpha, a full line supplier of materials used in the electronic assembly process such as solder paste, stencils, bar solder, and wire solver.
- Apollo Seiko, a frontrunner in the automated soldering industry.
For more information on Murray Percival and their line card, stop by booth #9 at the show.
About Murray Percival
Murray Percival Company was founded in January of 1960, and subsequently incorporated in the state of Michigan as the Murray A. Percival Company. They are currently the leading supplier to the Midwest's electronics industry, offering thousands of capital and distribution products as well as the industry’s leading process enabler. www.murraypercival.com
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.