Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Free eBook Guides Readers to Data Package Perfection
March 28, 2019 | The I-Connect007 TeamEstimated reading time: 1 minute
Hundreds of PCB designers have downloaded The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package micro eBook. Join this growing community of smart designers by exploring this comprehensive guide on how to perfect the hand-off from designer to fabricator.
This book is part of I-Connect007’s ongoing series, The Printed Circuit Designer’s Guide to…, which is specifically dedicated to educating PCB designers and serves as a valuable resource for readers seeking the most relevant information available. Written by Mark Thompson of Prototron Circuits, Producing the Perfect Data Package has everything you need to know to create a complete, accurate design data package.
In Prototron’s CAM department, Mark Thompson has seen it all. Many data packages he receives from PCB designers are either inaccurate, incomplete, or both, often putting the project on hold. Mark is passionate about educating his customers so that they can produce a perfect data package every time; now, he’s sharing this information with the PCB design community.
“Mark does an outstanding job detailing what needs to be included in the handoff between the board designer and fabricator,” said UltraCAD Design Founder Douglas Brooks, Ph.D. “Understanding and following his advice will lead to a smooth transition between these two functions. This book should be required reading for every designer.”
Kelly Dack, CID+, CIT, EPTAC, adds, “Mark Thompson is not afraid to ask for what he needs from a customer to start a job with the end in sight. In fact, he does the industry one better in this book by telling you what a PCB fabricator needs to get the complex job done right. Much appreciated!”
Download your free copy today! You can also view and download other titles in our full library.
We hope you enjoy The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package.
For more information, contact:
Barb Hockaday
I-007eBooks
barb@iconnect007.com
+1-916-365-1727
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.