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Advanced Electronics Packaging Digest

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Suggested Items

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change. Chemistry and current density have also traditionally received much of the industry's attention in plating optimization. But what if much of that optimization could begin before any hardware, chemistry, or current density changes were made?

Scanfil to Expand its Myslowice Plant in Poland

09/10/2026 | Scanfil
Scanfil is expanding its Myslowice plant in Poland following strong new customer wins. The expansion will increase the production complex by 6,000 square meters, bringing the total area to roughly 36,000 square meters upon completion. It will become Scanfil’s largest factory in Europe by floor area.

HyperLight Welcomes VentureTech Alliance to Series C

09/09/2026 | BUSINESS WIRE
HyperLight Corporation, a leader in thin-film lithium niobate (TFLN) photonics, announced that VentureTech Alliance (VTA) has joined its Series C financing round.

CAE, WB Electronics Advance Unmanned Systems Training Collaboration

09/09/2026 | PRNewswire
CAE and WB Electronics, a leading company in Poland's defence sector specializing in advanced technologies, announced the signing of a Memorandum of Understanding (MoU) at MSPO 2026.

Connecting Quality, Traceability, and Manufacturing Processes

09/09/2026 | Scott Ryan, Cetec ERP
Traceability is easy to describe and difficult to maintain. From the moment a component arrives, its supplier lot, inspection results, certificates, and eventual use in production have to be captured and carried forward into the finished assembly and shipment. Every step creates and requires information. In EMS and PCB assembly, products involve thousands of components, multiple levels of subassemblies, customer-specific requirements, revision changes, and supplier documents arriving in any number of formats. This becomes infinitely more difficult when quality, inventory, production, and document management live in separate systems.
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