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Teledyne MEMS Selected to Support Two FABrIC Challenge Award Recipients

06/29/2026 | BUSINESS WIRE
Teledyne MEMS announced that it has been selected as the advanced micro-electro-mechanical systems (MEMS) manufacturing partner for two recipients of the latest FABrIC Challenge funding awards announced by CMC Microsystems through the Government of Canada’s FABrIC initiative.

Microchip's Radiation-Tolerant Clock Generator Streamlines Spacecraft Timing

06/26/2026 | Microchip
Spacecraft timing systems must provide highly stable, precise signals for navigation, communications and scientific instruments, even when GNSS signals are weak or unavailable.

Henger Captivates the 2026 JPCA SHOW in Japan with Next‑Generation Plasma Technolog

06/19/2026 | Henger
From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries.

Marcy’s Musings: Old School vs. New School—When Does It Matter?

06/17/2026 | Marcy LaRont -- Column: Marcy's Musings
The battle between old and new is nothing new. Throughout history, technological progress has faced skepticism, resistance, and at times, outright hostility. Yet progress tends to win. In his book, "RenAIssance," author and APEX EXPO 2026 keynote Zack Kass illustrates this point beautifully. From hand weaving to sewing machines, from scribes to the printing press, from horse-drawn carriages to automobiles, and now to artificial intelligence, each technological leap has ultimately made our lives more productive and expanded what was possible.

MicroLED Interconnect Market to Reach $722M by 2033

06/16/2026 | PRNewswire
The global MicroLED interconnect market is entering a period of accelerated growth as artificial intelligence (AI), high-performance computing (HPC), and next-generation data center architectures drive demand for faster, more energy-efficient communication technologies.
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