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Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line

06/11/2026 | CEA-Leti
CEA‑Leti, a leading European research institute for microelectronics, reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.

Wistron Adopts NVIDIA Omniverse DSX to Accelerate Digital Factory Operations

06/10/2026 | Wistron
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Bose Announces Acquisition of StreamUnlimited Engineering GmbH

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Bose Corporation, a global leader in audio innovation and research, announced today it has acquired StreamUnlimited Engineering GmbH.

PCB Technologies to Exhibit at IMS 2026 in Boston

06/05/2026 | PCB Technologies Ltd.
Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and high-frequency electronics industry, taking place June 7th through June 13th, 2026, at the Thomas M Menina Convention and Exhibition Center in Boston, Massachusetts.
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