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The automatic optical inspection of solder joints after the selective soldering process is increasingly becoming the focus of process optimization. Regardless of whether the solder joints are realized using induction, laser or piston soldering processes or miniature waves, the quality of the selective solder joints must be evaluated automatically and reliably.
In line with this, Goepel electronic will be holding a webinar that will provide an overview of the integration of camera modules for 2D and 3D selective solder joint inspection in different production environments. During the presentation, attendees will learn more about the requirements for such integration solutions and how the technical details of the hardware and software of the camera modules are derived from them. In addition, the concepts for connecting the inspection solution to company-internal MES or traceability systems will be discussed.
The webinar, to be held on April 29, 2019 at 10am CDT (3pm UTC, 5pm MESZ), will be presented by David Whetstone, director of North American Sales Engineering at Goepel electronic.
For more information or to register, click here.
