OFFSET Seeks Proposals to Accelerate Swarm Tactics in Virtual Environments
April 4, 2019 | DARPAEstimated reading time: 1 minute

DARPA is soliciting creative proposals for the fourth swarm sprint in its OFFensive Swarm-Enabled Tactics (OFFSET) program. OFFSET envisions swarms of 250 collaborative autonomous systems providing critical capabilities to ground units in urban areas where challenges such as tall buildings, tight spaces, and limited sight lines constrain essential communications, sensing, maneuverability, and autonomous operations.
The swarm sprints aim to encourage rapid innovation and continuous incorporation of breakthrough technologies. Each of the five core sprints emphasizes one of the key OFFSET thrust areas – swarm tactics, swarm autonomy, human-swarm teaming, virtual environment, and physical testbed – to ultimately enable cross-cutting breakthroughs in swarm systems capabilities.
The fourth swarm sprint consists of two topics areas: developing synthetic technologies in the OFFSET virtual environments and identifying applications of artificial intelligence (AI) to discover and learn novel swarm tactics.
For the first topic area, proposers will seek to develop and implement synthetic capabilities in simulation, representing potential future technologies, such as distributed “see-through-wall” sensors, passive swarm communications, or enhanced sensor/computing arrays, to enable and demonstrate novel swarm tactics. Proposed technologies could be near-term advances that are being prototyped in laboratories or far-term ideas that are primarily conceptual but physically grounded.
The second topic area represents an ad hoc sprint for leveraging artificial Intelligence for accelerating swarm tactics design, for which sprinters will discover, learn, and harden novel swarm tactics by applying artificial intelligence frameworks via enhancements of the OFFSET virtual environments.
"With OFFSET, we are expanding the tactics available to warfighters, leveraging advances in autonomous systems to address complex challenges in urban environments," says Timothy Chung, program manager in DARPA’s Tactical Technology Office (TTO). “Exploring and developing swarm technologies in virtual environments today can yield insights and impact for real-world breakthrough capabilities tomorrow.”
DARPA also has awarded separate contracts for the third swarm sprint to Carnegie Mellon University and Soar Technology Inc., each of which will focus on development of advanced swarm tactics.
The third swarm sprint aims to augment the growing collection of swarm tactics in the OFFSET ecosystem, employing heterogeneous swarms of air and ground robots, and also to explore innovative technologies to enhance human-swarm teaming or how humans interact with autonomous swarms.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
U.S. Army Begins Fielding BAE Systems’ Mission-critical Software-defined Radios Across Rotary-wing Aviation Fleet
09/08/2025 | BAE SystemsBAE Systems’ AN/ARC-231A Multi-mode Aviation Radio Set (MARS) has completed initial installation and is operationally ready for use today on select U.S. Army rotary-wing aircraft.