-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Ushering in Ultrafast Cluster Electronics
April 5, 2019 | Hokkaido UniversityEstimated reading time: 1 minute
A new computational method can help fast track the development of tiny, ultrafast electronic devices made from small clusters of molecules.
Hokkaido University researchers have developed a computational method that can predict how clusters of molecules behave and interact over time, providing critical insight for future electronics. Their findings, published in the journal Scientific Reports, could lead to the creation of a new field of science called cluster molecular electronics.
Single molecule electronics is a relatively new, rapidly progressing branch of nanotechnology using individual molecules as electronic components in devices. Now, Hiroto Tachikawa and colleagues at Hokkaido University in Japan have developed a computational approach that can predict how clusters of molecules behave over time, which could help launch a new field of study for cluster molecule electronics. Their approach combines two methods traditionally used for quantum chemical and molecular dynamic calculations.
They used their method to predict the changes in a computer-simulated cluster of benzene molecules over time. When light is applied to the T-shaped benzene clusters, they reorganize themselves into a single stack; an interaction known as pi-stacking. This modification from one shape to another changes the cluster’s electrical conductivity, making it act like an on-off switch. The team then simulated the addition of a molecule of water to the cluster and found that pi-stacking happened significantly faster. This pi-stacking is also reversible, which would allow switching back and forth between the on and off modes.
When light is applied to the T-shaped benzene cluster in their computer simulation, they reorganized themselves into a single stack, changing its electrical conductivity. The addition of a molecule of water made the stacking occur significantly faster. (Tachikawa H., et al. Scientific Reports, February 20, 2019)
In contrast, previous studies had shown that the addition of a molecule of water to a single molecule electronic device impedes its performance.
“Our findings could usher in a new field of study that investigates the electronic performance of different numbers, types and combinations of molecular clusters, potentially leading to the development of cluster molecule electronic devices,” Tachikawa commented.
Suggested Items
Würth Elektronik at PEDC 2025
01/14/2025 | Wurth ElektronikOn January 29 to 30, 2025, the Pan-European Electronics Design Conference (PEDC) will convene leading experts from industry and research in Vienna.
Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
01/13/2025 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.
Ensuring Compliance with the U.S. CHIPS Act: Identifying the Source of Electronic Components
01/13/2025 | Dr. Eyal Weiss, CybordThe U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components.
IKT Electronics Chooses TRI's X-ray Technology
01/13/2025 | TRIIKT Electronics, a leader in innovative electronics manufacturing, proudly announces the expansion of its production capabilities with the integration of Test Research, Inc.'s (TRI) cutting-edge X-ray inspection system, the TR7600F3D SII.
Global Automated Optical Inspection Systems Industry Revolutionize Electronics Manufacturing with Advanced Quality Control
01/13/2025 | Globe NewswireThe global automated optical inspection (AOI) system market is poised for substantial growth, with sales estimated at USD 849.5 million in 2024 and projected to reach USD 2,067.0 million by 2034.