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iNEMI will be holding an all-day workshop on new developments and future plans for low-temperature solder materials and assembly techniques at NEPCON China in Shanghai on April 24, as part of the 2019 SMTA China East Conference.
Topics include the innovations required to improve yield and quality of low-temperature solder assemblies, processability, reliability and failure mechanisms of low-temperature solder materials, and more. iNEMI will also identify collaborative project opportunities to accelerate low-temperature solder technology development and deployment in the industry.
For more information, including agenda and registration, click here.
