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Advanced Packaging: Preparation is Now

11/20/2024 | Nolan Johnson, SMT007 Magazine
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.

Cadence Unveils Arm-Based System Chiplet

11/20/2024 | Cadence Design Systems
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.

GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System

11/19/2024 | Gen3
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.

New Ultrafast Memory Boosts Intel Data Center Chips

11/19/2024 | Intel
While Intel’s primary product focus is on the processors, or brains, that make computers work, system memory (that’s DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen).

Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024

11/19/2024 | Yamaha Robotics SMT Section
Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.
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