Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SEHO and Heller to Exhibit at Electronics Manufacturing Korea
April 15, 2019 | SEHO Systems GmbHEstimated reading time: 1 minute
SEHO Systems GmbH will exhibit at Electronics Manufacturing Korea, scheduled to take place May 15-17, 2019 at the COEX Exhibition Center in Seoul, South Korea. The company will demonstrate the StartSelective and MaxiSelective-HS in the Heller booth #A145.
With a footprint of only 2.5 m², the StartSelective provides maximum quality and reproducibility of soldering results for assemblies up to 20" x 20" and an outstanding return on investment. The StartSelective is thought through down to the last detail, from its compact design, ease of operation that does not require special skills, and many technical highlights.
All process-relevant components such as the micro drop jet fluxer, preheat system and maintenance-free electromagnetic soldering unit have successfully been in use for years in other soldering systems from SEHO. While all process steps are fully automated and monitored, loading and unloading of assemblies is done manually.
The MaxiSelective-HS is the ideal high quality selective soldering solution for when short cycle times are required. Parallel processes in the fluxing, preheating and soldering area, simultaneous contact of all solder joints with product specific multi-nozzle soldering tools, and the parallel transfer of the assemblies to the next work station make this the ideal system for mass production.
Two basic machine versions of the MaxiSelective-HS can be equipped with four or six stations working in parallel both offer the flexibility needed to meet your individual production requirements. Additional buffer stations at the inlet and outlet of the machine complete this high-speed system. In order to meet complex production challenges or o respond to increasing manufacturing volumes, the MaxiSelective-HS can be expanded with additional modules or it may be combined with other machine types at a later date.
For more information, visit www.seho.de.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.