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Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico

11/26/2024 | Plasmatreat
On-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.

HANZA Wins New Customer in Germany

11/25/2024 | HANZA
HANZA AB, listed on Nasdaq Stockholm, continues to secure new business, and has entered a manufacturing partnership with a leading German company specializing in advanced measurement equipment for mechanical components.

Heilind Asia Pacific Awarded 2024 'Best Strategic Account Development' by TE Connectivity

11/25/2024 | GlobeNewswire
Heilind Asia Pacific is excited to share that it has received the 2024 Best Strategic Account Development Award from TE Connectivity, in recognition of the company's outstanding performance in driving business growth and strengthening strategic customer relationships.

VORAGO Technologies, Collabora Partner to Advance Open Source in Space

11/25/2024 | GlobeNewswire
VORAGO Technologies, a leading provider of radiation hardened and radiation tolerant MCUs and MPUs for Aerospace and Defense, and Collabora, a leader in open source software and support, announced they are partnering to advance the use of open source to achieve resilience for mission critical applications in space.

Designing for Cost to Manufacture

11/21/2024 | Marcy LaRont, I-Connect007
ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
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