Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Rehm to Release Final Reflow Soldering Volume
April 25, 2019 | Rehm Thermal SystemsEstimated reading time: Less than a minute
Rehm Thermal Systems will be launching the fifth and final volume in the book series “Reflow Technology—Fundamentals of Reflow Soldering” at the upcoming SMTconnect event in Nuremberg, Germany. Attendees will also have the opportunity to have their books signed on May 8, from 10:30 am onwards, by the authors Dr. Hans Bell, Günter Grossmann, Helmut Öttl and Martin Oppermann at Rehm’s stand (Hall 4A-100).
The fifth volume, titled "Possibilities and Limits in the Analysis of Solder Joints," explains many of the analytical processes and techniques used in the manufacture of electronic products in a straightforward manner. It should help many to understand which tool is best suited to which application and, ultimately, the significance of analytical results.
The first four volumes of this book series are as follows: "Fundamentals of Materials Technology in the Field of Soldering," "Reflow Soldering Methods," "Reliability and Failure Management," and "The Consequences of Continuous Miniaturization."
The books can also be ordered via email at sales@rehm-group.com. Volumes 1 to 4 cost €48 each, while the fifth volume costs €58.
Share on:
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.