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Rehm to Release Final Reflow Soldering Volume
April 25, 2019 | Rehm Thermal SystemsEstimated reading time: Less than a minute
Rehm Thermal Systems will be launching the fifth and final volume in the book series “Reflow Technology—Fundamentals of Reflow Soldering” at the upcoming SMTconnect event in Nuremberg, Germany. Attendees will also have the opportunity to have their books signed on May 8, from 10:30 am onwards, by the authors Dr. Hans Bell, Günter Grossmann, Helmut Öttl and Martin Oppermann at Rehm’s stand (Hall 4A-100).
The fifth volume, titled "Possibilities and Limits in the Analysis of Solder Joints," explains many of the analytical processes and techniques used in the manufacture of electronic products in a straightforward manner. It should help many to understand which tool is best suited to which application and, ultimately, the significance of analytical results.
The first four volumes of this book series are as follows: "Fundamentals of Materials Technology in the Field of Soldering," "Reflow Soldering Methods," "Reliability and Failure Management," and "The Consequences of Continuous Miniaturization."
The books can also be ordered via email at sales@rehm-group.com. Volumes 1 to 4 cost €48 each, while the fifth volume costs €58.
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