Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Rehm to Release Final Reflow Soldering Volume
April 25, 2019 | Rehm Thermal SystemsEstimated reading time: Less than a minute
Rehm Thermal Systems will be launching the fifth and final volume in the book series “Reflow Technology—Fundamentals of Reflow Soldering” at the upcoming SMTconnect event in Nuremberg, Germany. Attendees will also have the opportunity to have their books signed on May 8, from 10:30 am onwards, by the authors Dr. Hans Bell, Günter Grossmann, Helmut Öttl and Martin Oppermann at Rehm’s stand (Hall 4A-100).
The fifth volume, titled "Possibilities and Limits in the Analysis of Solder Joints," explains many of the analytical processes and techniques used in the manufacture of electronic products in a straightforward manner. It should help many to understand which tool is best suited to which application and, ultimately, the significance of analytical results.
The first four volumes of this book series are as follows: "Fundamentals of Materials Technology in the Field of Soldering," "Reflow Soldering Methods," "Reliability and Failure Management," and "The Consequences of Continuous Miniaturization."
The books can also be ordered via email at sales@rehm-group.com. Volumes 1 to 4 cost €48 each, while the fifth volume costs €58.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.