Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Rehm to Release Final Reflow Soldering Volume
April 25, 2019 | Rehm Thermal SystemsEstimated reading time: Less than a minute
Rehm Thermal Systems will be launching the fifth and final volume in the book series “Reflow Technology—Fundamentals of Reflow Soldering” at the upcoming SMTconnect event in Nuremberg, Germany. Attendees will also have the opportunity to have their books signed on May 8, from 10:30 am onwards, by the authors Dr. Hans Bell, Günter Grossmann, Helmut Öttl and Martin Oppermann at Rehm’s stand (Hall 4A-100).
The fifth volume, titled "Possibilities and Limits in the Analysis of Solder Joints," explains many of the analytical processes and techniques used in the manufacture of electronic products in a straightforward manner. It should help many to understand which tool is best suited to which application and, ultimately, the significance of analytical results.
The first four volumes of this book series are as follows: "Fundamentals of Materials Technology in the Field of Soldering," "Reflow Soldering Methods," "Reliability and Failure Management," and "The Consequences of Continuous Miniaturization."
The books can also be ordered via email at sales@rehm-group.com. Volumes 1 to 4 cost €48 each, while the fifth volume costs €58.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.