Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
TopLine MCS Reliability Solution Published in NASA SPINOFF
May 2, 2019 | TopLineEstimated reading time: 1 minute
TopLine’s innovative Micro-coil Springs (MCS Series) have been featured in NASA’s 2019 edition of SPINOFF, the annual Information Technology publication of NASA’s Technology Transfer Program. A full-page feature titled “Tiny Springs Improve Electronic Reliability” describes the MCS innovation on page 137.
Micro-coil springs are a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments, where they can absorb extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics.
Engineers at NASA's Marshall Space Flight Center developed this unique interconnection structure for integrated circuit packages. This innovation replaces traditional CCGA solder columns with the potential to extend life under harsh environments, extreme thermal stress, vibration and shock. Working with TopLine engineers, NASA granted an exclusive license to TopLine to manufacture and sell the MCS product, which may also be used in place of solder balls on plastic PBGA packages.
TopLine CEO Martin Hart said that “The applications include anywhere that there are large temperature swings,” but notes, “We’re still at the beginning of discovering the market.” But he says that the NASA origins have helped open doors. “When the customer realizes that the invention was made at NASA, they’re more willing to listen, read about it, consider buying it.”
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.