-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Kulicke & Soffa to Exhibit at SMTconnect 2019
May 7, 2019 | Business WireEstimated reading time: 1 minute
Kulicke & Soffa Industries, Inc. is exhibiting at the SMTconnect 2019 trade show in Nuremberg, Germany, from May 7 through 9, 2019.
Kulicke & Soffa’s latest flexible Electronics Assembly (EA) equipment will debut at the trade show along with other range of assembly and packaging solutions in Hall 4A, Booth #440. Apart from delivering high accuracy, maximum versatility with maximized feeding space, the new EA equipment has an improved and unique SlimFit Feeding system, which improves the handling, uptime and reduces change over significantly. The system supports industry 4.0 applications, via the IoT Box for performance monitoring as well as material management and traceability. Along with the equipment is a facial recognition system which offer fast and touchless high-speed authentication access to the system.
Other recently introduced K&S’s solution such as the RAPID Pro GEN-S series ball bonder, Asterio hybrid wedge bonder, consumable materials and tools will also be showcased. In addition, the iFlex T2 equipment will be featured as part of the IPC CFX showcase with real-time demonstrations at K&S’s booth.
Joeri Durinckx, Kulicke & Soffa’s Senior Director for EA/APMR Business Unit, said, “With the emerging needs of cybersecurity in the smart manufacturing environment, the use of advanced sensor technology, such as facial recognition, will reduce human dependency enhancing factory security and efficiency.”
About Kulicke & Soffa
Kulicke & Soffa is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.
Suggested Items
Nokia, Honeywell Aerospace Technologies Partner with Numana to Advance Quantum-safe Networks
04/01/2025 | HoneywellNokia and Honeywell Aerospace Technologies announced a strategic partnership with Numana to advance Quantum-Safe Networks (QSN) in Montreal, Canada, and worldwide.
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Incap Launches ‘Incap Legends’ esports Tournament and Invites Students from Around the World to Participate
03/31/2025 | IncapIncap Corporation is proud to announce the launch of ‘Incap Legends’, a new esports tournament in partnership with Newcastle and Stafford Colleges Group (NSCG).
Foxconn Chairman Young Liu to Deliver Keynote at COMPUTEX 2025
03/28/2025 | PRNewswireTAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future.