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Managing Energy Flow with Proper Stackup Design 

02/13/2025 | Andy Shaughnessy, Design007
At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly. 

Multilayer PCB Market to Reach $116.1B by 2032 at 5.5% CAGR: Allied Market Research

02/12/2025 | Globe Newswire
According to the report, the "multilayer printed circuit board market" was valued at $71 billion in 2023, and is estimated to reach $116.1 billion by 2032, growing at a CAGR of 5.5% from 2024 to 2032.

MBK Partners Consortium to Acquire FICT Limited

02/11/2025 | FICT Limited
MBK Partners , one of the largest independent private equity groups in Asia, is acquiring the outstanding shares of FICT Limited, a global leader in interconnection technology, which includes high-multilayer printed circuit boards and build-up substrates.

Designers Notebook: Addressing Future Challenges for Designers

02/06/2025 | Vern Solberg -- Column: Designer's Notebook
The printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.

Connect the Dots: Designing for Reality—Surface Finish

01/29/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.
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