-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 2)
May 8, 2019 | Greg Smith, BlueRing StencilsEstimated reading time: 12 minutes

Editor's Note: Read the Part 1 of this article here.
Results
Transfer Efficiency: Uncoated Metal Stencils
Initially, all seven materials were printed and the uncoated stencil data was analyzed for all area ratios of apertures. The top performers were identified based specifically on transfer efficiency in this analysis. The results are shown in Figure 5. Materials 1 and 2 exhibit better print transfer efficiencies with uncoated apertures than the other materials.
Figure 5: Transfer efficiency of uncoated stencils for all area ratios and metal types.
Since small area ratio printing is key in product miniaturization, it is important to determine which uncoated material performed the best from 0.3–0.5 area ratios. These area ratios are defined as small area ratio printing because they are below the recommendation in IPC7525B standard of 0.66 [2]. Figure 6 shows the results for 0.3, 0.4, and 0.5 area ratio apertures only.
Figure 6: Transfer efficiency of uncoated stencils for all metals and 0.3, 0.4, and 0.5 area ratios.
As shown previously, Metal 1 has the highest transfer efficiency results versus the other metals for the 0.3, 0.4, and 0.5 area ratio prints. It also outperformed the second-best material, Material 2, when comparing the means by over 15%. Material 2 shows a 5% improvement over the third-best material when comparing mean transfer efficiencies (Table 3).
Table 3: Mean transfer efficiency of uncoated stencils for all metals and 0.3, 0.4, and 0.5 area ratios.
Another interesting observation is that at 0.5 area ratio, the differences in transfer efficiency results increase significantly versus the 0.3 and 0.4 area ratios with Materials 1, 2, and 4 easily surpassing the 80% transfer efficiency numbers typically required to pass SPI. Using Tukey-Kramer HSD, Material 1 is statistically the best performing material when measuring transfer efficiency on small area ratio apertures (Figure 7), and Material 2 are statistically in the second-best performing group for transfer efficiency with the highest mean transfer efficiency in that group.
Figure 7: Tukey-Kramer HSD on transfer efficiency for 0.3, 0.4, and 0.5 area ratios.
The final analysis of uncoated stencil foils is to examine larger area ratios to understand if material type affects transfer efficiency. All materials were observed printing at area ratios 0.6, 0.7, and 0.8. The following chart shows the results (Figure 8).
Figure 8: Transfer efficiency of uncoated stencils for all metals and 0.6, 0.7, and 0.8 area ratios.
Once again, it can be observed that Metals 1 and 2 outperform the others when measuring transfer efficiency for the larger area ratios. Mean transfer efficiency for Metal 1 was greater than the mean of Metal 2 by just under 5%, and the mean transfer efficiency for Metal 2 was 5% better than the next best performing Metal 4. Again, we see a large increase in transfer efficiency when moving from 0.6 and 0.7 area ratio printing to 0.8 area ratio printing.
Page 1 of 3
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.