Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
NEO Tech to Discuss Product Commercialization at IoT World 2019
May 10, 2019 | NEO TechEstimated reading time: Less than a minute
NEO Tech will showcase connectivity design and manufacturing experience in booth 762 at the Internet of Things (IoT) World, which is scheduled to take place May 13-16, 2019 at the Santa Clara Convention Center in California.
NEO Tech provides OEMs implementing IoT technology a wide range of product commercialization services with an industry-leading product design services team offering a wide range of wireless connectivity design experience that spans industrial, medical and aerospace markets. The company’s design services are seamlessly connected to its 14 manufacturing locations where it supplies turnkey product manufacturing services that deliver rapid time to market and scalability to meet difficult product ramps.
Examples of NEO Tech’s IoT product commercialization experience includes (but is not limited to):
- Home automation devices
- Wireless industrial device connectivity
- Wirelessly connected medical sensors and devices
- Aviation industry wireless automation
- Low-power Bluetooth optimization
About NEO Tech
NEO Tech combines the strengths of three leading contract manufacturers: NATEL, EPIC, and OnCore. With over 40 years of heritage in electronics manufacturing, NEO Tech focuses on low-medium-volume/high-mix, high-complexity products primarily in the medical, defense/aerospace and industrial markets.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Siemens, TRUMPF Partner to Accelerate Digital Manufacturing and AI Readiness
09/16/2025 | SiemensTechnology company Siemens and leading machine tools and laser manufacturer TRUMPF announced a partnership that promises to elevate industrial production by harnessing advanced digital manufacturing solutions.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.