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Fresh PCB Concepts: Everything Your PCB Supplier Needs Upfront for Quoting

08/27/2026 | Team NCAB -- Column: Fresh PCB Concepts
After more than 40 years in PCB manufacturing, I've come to appreciate that every PCB begins long before the first sheet of laminate enters a press or the first hole is drilled. A PCB’s journey begins with a request for quotation (RFQ). I’ve been involved with documentation practices since the days of 4:1-scaled and Blue & Red-taped mylars. They all underwent photo-reduction and resizing to 1:1-scale film for manufacturing, and this became our tooling package. With new media and technology involved, this process has undergone many changes, but the focus on tooling can never waver. I have learned that the accuracy of the quotation is directly tied to the quality of the information received. 

Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

08/25/2026 | SMTA
The Electronics Manufacturing & Assembly Collaborative (EMAC) announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026, and for the first time in the competition's history, two teams tied for first place.

MKS’ Atotech Showcases Copper Via-Fill Solutions for Next-Gen RDL at SEMICON Taiwan

08/25/2026 | Atotech
MKS Inc., a global provider of enabling technologies that transform our world, announced that Dr. Britta Schafsteller, Global Product Manager Semiconductor at MKS’ Atotech, will speak at the upcoming Heterogeneous Integration Global Summit during SEMICON Taiwan.

Qnity Expands AI-Driven Advanced Packaging with End-to-End Process Solutions

08/25/2026 | BUSINESS WIRE
Qnity Electronics, Inc. , a premier technology solutions leader across the semiconductor value chain, introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems.

A Better Way to Characterize Copper Foils for Flexible Printed Circuits, Advanced Packaging

08/25/2026 | Nolan Johnson, I-Connect007
Finite element analysis is only as accurate as the material properties behind it. Kenji Koike discusses research showing that digital image correlation produces more precise stress-strain curves and Young's modulus measurements for rolled copper foils, giving engineers greater confidence when designing flexible printed circuits and advanced packaging for demanding applications.
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