It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
CIMS Debuts Through Laser Via Inspection Solution
May 28, 2019 | CIMSEstimated reading time: Less than a minute
Through laser via is a process of producing through-holes in ultra-high density PCB and IC substrates using laser drilling systems. This advanced process achieves much smaller diameter holes compared to traditional mechanical drilling.
The Galaxy VIA series is CIMS' latest solution for inspecting through laser via produced with this process. It is designed to detect all types of defects within the holes and control the narrowing down of the drill opening, sometimes referred to as via neck.
Galaxy VIA systems are equipped with brand new illumination called ViaLight, designed for transmissive light inspection to get the most accurate image of the interior of the holes.
The systems in the Galaxy VIA series are capable of inspecting through laser via drills as small as 20 microns in diameter, can detect undersize and oversize defects, contamination and debris inside, can identify plugged or missing holes as well as drill shifts beyond allowable tolerances.
Powerful statistical packages further extend capabilities of Galaxy VIA series providing real time process control used for laser drill tool calibration.
The Galaxy VIA 20μ model has been showcased during the last CTEX show in Suzhou, China.
Share on:
Suggested Items
At Schneider Electric, The Future of MES/MOM Lies in the Cloud
11/26/2024 | Schneider ElectricSchneider Electric’s mission is to be the trusted partner for sustainability and efficiency. The company is helping customers across industries unlock efficiency, productivity, and resilience through digital transformation. Schneider Electric is also accelerating its own digital transformation across production facilities.
HPC Customer Engages Sondrel for High End Chip Design
11/25/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
11/25/2024 | Anaya Vardya -- Column: Standard of ExcellenceIn continuing my series on finding, signing, and keeping good people for your company, this month we discuss hiring good people for your quality department. Even when hiring was easier, hiring for the quality department has always been especially challenging. It takes a special kind of person: someone with attention to detail, someone ready to stand for his or her convictions, and someone who can stand up under pressure when the company needs to ship product and the quality manager refuses to because it is not up to par. The quality department is the very soul of any manufacturing company.
Rules of Thumb for PCB Layout
11/21/2024 | Andy Shaughnessy, I-Connect007The dictionary defines a “rule of thumb” as “a broadly accurate guide or principle, based on experience or practice rather than theory.” Rules of thumb are often the foundation of a PCB designer’s thought process when tackling a layout. Ultimately, a product spec or design guideline will provide the detailed design guidance, but rules of thumb can help to provide the general guidance that will help to streamline the layout process and avoid design or manufacturing issues.