-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
Article Highlights
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Hermes Standard to Replace SMEMA—Available with Rehm
May 29, 2019 | Rehm Thermal SystemsEstimated reading time: 3 minutes
Adaptability to demand, efficiency, simplicity, networking—these are the defining buzzwords for today’s industry. In a smart factory it is essential for the entire production system to be networked and able to access all process and assembly data at any time. It is particularly important for SMT lines made up of systems from different manufacturers to guarantee that such networking also remains independent of the manufacturer. All of this can be achieved easily with the “Hermes Standard”. For the convection soldering system VisionXP+, Rehm Thermal Systems offers two variants with “The Hermes Standard”.
Image Caption: A picture of the convection soldering system VisionXP+ from Rehm Thermal Systems has been added
Fast, network-based communication between the individual machines is enabled by the Hermes Standard: an option that was unavailable with the previous SMEMA standard. For this reason, an independent group of leading SMT equipment manufacturers, including Rehm Thermal Systems, has come together to develop a new interface: The Hermes Standard. With the previous SMEMA interface, communication from individual machines was reduced to digital signals: Machines did not communicate directly with each other; instead, the circuit board data was held in the MES systems at a higher level. A scanner was required in front of each machine to identify the assemblies.
By contrast, the Hermes Standard links the individual machines together via a direct form of horizontal communication. Data is exchanged throughout the entire SMT line, directly from machine to machine (M2M), and the data packets move through the machine together with the circuit boards. The Hermes data package is initially created at the start of the production line. There the barcode is printed, lasered or read in via a scanner. This data package is now communicated from machine to machine together with the circuit board. The new extension of the vertical interface introduced with Hermes 1.2 allows the circuit boards to be tracked in a production line or provides the option of synchronising the assembly’s data with an MES. This new form of interface communication is via TCP/IP and XML-based protocol, which uses standardised Ethernet hardware components and a flexible data format. This simplifies the integration process and reduces costs. In addition to the barcode of the assembly, other types of data (e.g. product, width, transport speed and similar) are communicated.
Customers of Rehm Thermal Systems seeking Hermes interface communication for the convection soldering system VisionXP+ can choose between two versions: one with a scanner on the outfeed conveyor and one without. Without the scanner on the outfeed conveyor it is not possible to manually reinsert a board. This reduces the risk of data being lost or being assigned to the wrong assemblies. If a scanner is present on the outfeed conveyor, boards can be removed after soldering and reinserted as the user requires. This is particularly important if a visual inspection is performed manually or if random samples are to be taken for quality assurance purposes. The correct assignment of data to the correct board is nevertheless preserved.
The convection soldering systems of the VisionX series from Rehm are also CFX-ready. With the CFX interface (IPC-CFX), communication is vertical and network-based. While the Hermes Standard is used primarily for M2M communication, the CFX is used for data uploading and downloading and for data analysis. The combination of horizontal Hermes communication and vertical CFX communication is absolutely necessary for a smart factory in the long run and represents a further step towards standardization.
About Rehm Thermal Systems
Rehm is a technology and innovation leader in the state-of-the-art, cost-effective manufacturing of electronic assembly groups and specialises in thermal system solutions for the electronics and photovoltaics industry. Rehm is a globally active manufacturer of reflow soldering systems using convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customised systems. We have a presence in all key growth markets and, as a partner with almost 30 years of industry experience, we are able to implement innovative production solutions that set new standards.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.