-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Ersa: Drone Technology Meets Manual Soldering
May 31, 2019 | ErsaEstimated reading time: 2 minutes
"Drones are safe and reliable when, among other things, all components are correctly soldered," Jörg Nolte, product manager soldering tools, rework and inspection systems, started his introductory lecture at the two workshops on manual soldering at the University of Zielona Gora in Poland and at the Technical University in Chemnitz. The idea for these two workshops was born during the CURPAS International Annual Conference in the summer of 2018, where Nolte spoke to drone experts about solder joints for the first time. "We discussed the topic of electronics in unmanned systems with Mr. Nolte right from the start. The assembly of the UAS stands at the very beginning of the value chain that we defined. Since we at CURPAS see our task in bringing together experts from various disciplines, it was obvious that we wanted to bring the expertise of Mr. Nolte and Ersa to the association and its members to ensure a transfer of know-how to the next generation of engineers," explains Dr. Christina Eisenberg, treasurer and network manager of the GRW network CURPAS.
Both in Zielona Gora (Poland) and at the TU Chemnitz more than 30 students from different technical studies participated in the workshops. These consisted of a presentation in which Manfred Wolff, soldering specialist from Ersa, gave a detailed lecture on electronics production and in particular on the importance of solder joints. In a second presentation, the participants were given an insight into the application areas of drones, which was concluded in Poland with a flight demonstration by the Zielona Gora fire brigade. At the Technical University in Chemnitz, the German drone manufacturer Tholeg Robotics, a member of CURPAS e.V., presented its drone for police and fire brigade operations and answered students' questions about flight times, possible applications and legal framework conditions. The workshop ended with a live demonstration of manual soldering, in which the students were able to try Ersa soldering tools themselves. In addition, students in Poland and Germany were able to win an Ersa soldering station.
"Drones are flying robots jam-packed with electronics. We wanted to show the students in the workshops how important electronics are and what they have to pay attention to when it comes to their development. Unmanned systems will take over many tasks in the future and many of the workshop participants will work in these areas. That is why we have been running these events with CURPAS because we want to share our know-how with the future developers of such systems," said Nolte after the workshop in Chemnitz. Eisenberg adds: "We see these two events as pilot projects for further opportunities to work with Ersa. The number of participants proofed us right and I was surprised at how many young women took part in the workshops. I therefore assume that we will intensify the cooperation. It is also important that a reference is made to real applications. That is why we also involved users and drone manufacturers in the events."
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.