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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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iNEMI Schedules Smart Manufacturing Session at SEMICON West
June 20, 2019 | iNEMIEstimated reading time: Less than a minute
Join iNEMI in San Francisco on July 9, from 10:00 a.m. to noon, at SEMICON West (Moscone Center). We are hosting a meeting that will highlight iNEMI’s Smart Manufacturing roadmap and include a brainstorming session on potential new projects in the areas of back-end commonality (packaging, inspection, test and more).
Brainstorming topics will include advanced packaging (media, tools optimization), data analytics, etc. Confirmed attendees include Intel, AMD, Rudolph, KNS, Cimetrix, Jabil, ASM, SEMI and others. Please contact Urmi Ray, by June 30 if you want to attend.
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