-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Naprotek Purchases a Nordson SELECT Selective Soldering System
June 21, 2019 | Naprotek, Inc.Estimated reading time: 2 minutes

Naprotek, Inc. has purchased the Nordson SELECT Cerno 103IL selective soldering system. The robust system provides the company with an exceptional combination of versatility and productivity.
“Naprotek is adding selective solder capability to increase our flexibility and speed to better support our customers’ needs,” stated Larry Morrissey, vice president of Operations. “Selective solder allows much faster soldering of through-hole components without the added requirement for wave solder fixtures and additional setup time.”
The Cerno 103IL has many unique features, including high-speed Z-axis motion for faster processing time and reduced soldering cycle. With its flexible configuration, the Cerno 103IL is a versatile selective soldering system capable of processing tin-lead, lead-free or HMP solder alloys.
Morrissey added, “Fast programming and execution with the Cerno 103IL saves time in the process. This allows us to meet critical deadlines. Selective solder also prevents exposing the board to the additional heat cycle experienced during wave solder. Having the ability to individually solder a single component or a small subset of components on the board is a definite productivity improvement.”
With its feature rich, graphics-based programming and machine control software, the Cerno 103IL is specially designed for demanding selective soldering applications. Setup and time to first article is significantly reduced to within 10-15 minutes. The SWAK-OS 4.0 software features seamless fiducial recognition, live teach cameras, real-time data collection, SQL back-end data extraction and complete FIS capability for shop floor integration.
About Naprotek Inc.
Founded in 1995 by entrepreneur Najat El-Ayi Badriyeh, Naprotek has provided electronic manufacturing services to startups and OEMs in Silicon Valley and throughout the US. Naprotek evolved from a consigned-assembly business to a full-suite service provider for printed circuit assemblies and box-build. Naprotek’s track record continues to benchmark quality, service and cost-effective solutions for its customers. The company has a strong footprint in the military and aerospace markets with its AS 9100 certification, as well as the medical market with its ISO 13485 certification.
About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra® multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.