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Real Time with... productronica 2025: KYZEN's Approach to Innovative Cleaning Solutions for Electronics

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Connect the Dots: The Future of Designing for Reality—Electroless Copper

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On a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity. 

Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities

11/26/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Solderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.

IBM Introduces Next-Generation Quantum Processors and Breakthrough Software for Fault-Tolerant Computing

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At the annual Quantum Developer Conference, IBM unveiled fundamental progress on its path to delivering both quantum advantage by the end of 2026 and fault-tolerant quantum computing by 2029.
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