Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Collins Aerospace's David Adams Earns Dieter Bergman IPC Fellowship Award
July 1, 2019 | IPCEstimated reading time: 1 minute
In recognition of his ongoing leadership in developing and promoting IPC standards on a global basis, IPC – Association Connecting Electronics Industries bestowed a Dieter Bergman IPC Fellowship Award upon David Adams, Collins Aerospace, at IPC SummerCom on June 17.
This recognition is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry and embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. Award recipients are eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice. Adams’s selection was the Pennsylvania State University College of Engineering.
Adams has supported IPC’s standardization efforts for more than 20 years and has served on nearly three dozen IPC committees, including serving as vice chair of the 5-24C Solder Alloy Task Group.
“For more than two decades, Dave has generously shared his knowledge and experience, guiding many task groups and new IPC members on the standards development and revision process. If you have a question, he will spend all the time you need to explain it to you, and he takes a sincere interest in the people around him,” said David Bergman, IPC vice president of standards and technology. “He has always been one to go the extra mile – volunteering to be on A-teams, filling in for absent chairs or co-chairs, and helping countless newcomers learn the ropes. IPC and the entire electronics industry are fortunate to have Dave volunteer his time and expertise to IPC standards and program development. His work has enriched both the industry and IPC and we are thankful for his dedication,” Bergman added.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.