Global Radio Frequency Components Market Size to Reach $45.05B by 2025
July 1, 2019 | PRNewswireEstimated reading time: 2 minutes
The global radio frequency components market size is expected to reach $45.05 billion by 2025 registering a CAGR of 14%. High demand for devices capable of establishing direct wireless connectivity with the internet, including smartphones, tablets, smartwatch, drones, smart television, and smart homes devices is anticipated to drive the market over the forecast period. Technological evolution in the field of wireless communication and developments in materials used for manufacturing RF components, such as Gallium Arsenide (GaAs) and Silicon Germanium (SiGe), is also expected to augment market growth.
These materials allow the integration of digital and analog electronics into a single chip, thus lowering the cost of the components manufactured.These components find applications in several industries including military, automotive, and consumer electronics.
The consumer electronics application segment is estimated to witness substantial growth in coming years owing to increasing consumer spending on electronic devices, such as tablets, personal computers, laptops, and smartphones, as a result of rising disposable income levels.Moreover, the development of innovative RF technologies offer products with a dynamic power range, higher frequencies, and lower noise parameters, enabling design of next-generation electronic components.
Increasing popularity and adoption of high-speed networks, such as 4G and 5G, have significantly impacted the product demand.
According to the International Telecommunication Union (ITU), the global mobile cellular telephone subscriptions gradually rose from 7,181 million in 2015 to 8,160 million in 2018.Moreover, the number of internet users stood at 3,170 million globally in 2015, which further increased to 3,896 million in 2018.
The trend, showing a steady rise in the number of subscribers of internet andmobile cellular telephone across the globe, is likely to have a positive impact on the growth prospects of the market in near future. Escalating demand for wireless communication solutions, including 5G, to enable wider channel bandwidths and greater data capacity than current or previous generation networks has resulted in the increased need for advanced RF solutions, such as switches, integrated modules, phase shifters, and other high-performance RF solutions.
Furthermore, operating frequency of 5G ranges from 24 GHz to 95 GHz, providing high-data-rate wireless connections, such as 4K/8K ultra High-Definition (HD) TV streaming.Due to this, there is an increased demand for RF components in wireless devices to offer greater coverage area and reduced latency of 5G networks.
On the other hand, rise in the prices of raw materials is expected to negatively hamper the market growth.Based on competitive dynamics, the vendor landscape of the RF components market is highly fragmented in nature, resulting in intense competition by key companies and causing variation in price margins.
Prominent companies in the market include Taiwan Semiconductor Manufacturing Co. Ltd.; Texas Instruments, Inc.; Renesas Electronics Corp.; and NXP Semiconductors N.V.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.