Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
TRI Launches Smart Test and Inspection Solutions at NEPCON Asia
July 3, 2019 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join NEPCON Asia held at the Shenzhen Exhibition & Convention Center to feature innovative SMT inspection solutions for the smart factories. Visit booth #1H55 to experience Smart Factory Inspection Solutions in action.
TRI will unveil the high-resolution 3D AXI TR7600F3D SII with unprecedented speed, twice as fast as its award-winning past models. Furthermore, TRI will be presenting the new multi-angle 3D AOI solution TR7500QE SII offering higher quality imaging. TRI is also featuring the new TR7700 SV 3D AOI combining high resolution with a 10 µm optical resolution and a 12MP high-speed camera.
The TRI lineup for NEPCON Asia will include the award-winning 3D AOI TR7700Q with leading-edge solder fillet inspection with 1um high-resolution inspection capability and the Global Technology Award-winning TR7007Q series 3D SPI, designed for zero-escape industry applications. Additionally TRI will present the Multicore ICT TR5001Q SII Inline and the brand new MDA TR518 SII Drawer with 2560 testing points.
Visit TRI's booth #1H55 at NEPCON Asia to discuss your production line requirements, and experience smart test and inspection solutions for the connected factory.
About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated X-ray inspection (AXI) systems to manufacturing defect analyzers (MDA), in-circuit test equipment (ICT), and functional testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.