Flexible PCB Market to Show Solid CAGR of 12.6% during 2018-2023
July 10, 2019 | Kenneth ResearchEstimated reading time: 1 minute
It is anticipated that the global flexible printed circuit board market will show a solid CAGR of 12.6% during the forecast period 2018 to 2023. Factors, for example, expanding interest for customer gadgets, and the quickly developing popularity of adaptable presentation innovation is giving an impetus to the global flexible printed circuit board market.
As conventional wire tackles neglect to take into account the applicable prerequisites of present-day electronic segments, they are being supplanted by cutting edge adaptable printed circuits. Throughout the years, flexible circuit technology has kept on advancing, empowering undertaking of complex segment plan. What's more, it is assumed a significant job in scaling down of electronic parts.
Major Players
Fujikura Ltd., Nitto Denko Corporation, MFS Technology, Daeduck GDS Co. Ltd., and Zhen Ding Tech, Career Technologies, bhflex Co. Ltd., Sumitomo Electric Industries Ltd., Flexible Circuit, Interflex Co. Ltd., among others are some of the major players in the global flexible printed circuit board market.
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