Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
KIC to Exhibit Its Ecosystem of Smart Factory Solutions at SMTA Queretaro
July 12, 2019 | KICEstimated reading time: 1 minute
KIC will exhibit at the SMTA Queretaro Expo & Tech Forum, scheduled to take place Thursday, August 15, 2019 at the Misión Grand Juriquilla in Queretaro, Mexico. KIC Sales Manager, Miguel Carbajal will discuss the KIC ecosystem of Smart Factory solutions, including the RPI i4.0, winner of the 2018 Mexico Technology Award.
From profilers to software, providing traceability, automation, data collection and analytics, connectivity and machine learning, KIC offers low risk/low cost products, making that first step of implementing a Smart Factory easy and fast.
RPI i4.0 is an easy built-in solution for automation, traceability, advanced reflow data collection and sharing for Smart Factory integration. KIC RPI i4.0 automatically acquires profile data from each PCB soldered in the reflow or curing oven, in real-time. This new ecosystem offers real-time thermal process dashboard and traceability, reduced scrap and rework, fast defect troubleshooting, lower electricity use and more. Advanced data search and communication features save engineers valuable time.
With RPI i4.0, all relevant data can connect to the factory MES or your factory data collection system to be easily shared with personnel, and can be accessed from any authorized PC or mobile device. The enhanced level of automation delivers improved line utilization and productivity.
Move toward the future of line connectivity, flexible production, process transparency, machine learning and real-time insight.
About KIC
KIC is a technology company working to make reflow ovens smarter through thermal profiling automation and optimization solutions. With offices across the globe, KIC is ready to become your partner in oven-based manufacturing. Corporate headquarters are located at 16120 W Bernardo Dr., San Diego, CA 92127. https://kicthermal.com.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.