-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Fuji America Expands its Western Rep Network
July 12, 2019 | Fuji CorporationEstimated reading time: 1 minute
Fuji America Corporation, the world’s leading supplier of surface mount technology pick & place and smart factory software solutions, announces its newest sales representative in the Western Region, Alphatek, Inc.
Customers in the Rocky Mountain region (including Colorado and Utah) will have access to Fuji’s placement technologies, Nexim enterprise software and automation tools with experienced local representation.
Alphatek, Inc. has been in business for over 25 years and is committed to providing customers with superior products, technical expertise and after-sales support. The company has extensive knowledge of circuit board and microelectronics assembly, and serves many markets including: aerospace, telecommunications and medical devices.
“Adding Alphatek is part of our ongoing initiative of local Fuji service and support for our customers across every region of the country,” said Tom Zabkiewicz, executive vice president. “Having deep customer relationships is critical as we move into the next level of Smart Factory technology and low volume/high mix market requirements. We are excited to take these next steps in the region.”
About Fuji Corporation
Fuji Corporation is a market-leading supplier of surface mount technology (SMT) pick & place solutions, and has designed and manufactured many ground-breaking innovations in the circuit board assembly world. Fuji also offers a range of mounting machines, solder printers and production software that can easily integrate into a myriad of manufacturing environments to ensure that equipment runs competitively at all times. Service, training and support are provided by Fuji’s Global network of subsidiaries and official partners. Fuji Corporation’s North American Headquarters is located in Vernon Hills, IL, (near Chicago) as well as other North American regional offices and support centers in Fremont, CA, Guadalajara and Queretaro MX, and Ontario CN. Visit www.fujiamerica.com, for further information on our comprehensive line of SMT product.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.