-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Fuji America Expands its Western Rep Network
July 12, 2019 | Fuji CorporationEstimated reading time: 1 minute
Fuji America Corporation, the world’s leading supplier of surface mount technology pick & place and smart factory software solutions, announces its newest sales representative in the Western Region, Alphatek, Inc.
Customers in the Rocky Mountain region (including Colorado and Utah) will have access to Fuji’s placement technologies, Nexim enterprise software and automation tools with experienced local representation.
Alphatek, Inc. has been in business for over 25 years and is committed to providing customers with superior products, technical expertise and after-sales support. The company has extensive knowledge of circuit board and microelectronics assembly, and serves many markets including: aerospace, telecommunications and medical devices.
“Adding Alphatek is part of our ongoing initiative of local Fuji service and support for our customers across every region of the country,” said Tom Zabkiewicz, executive vice president. “Having deep customer relationships is critical as we move into the next level of Smart Factory technology and low volume/high mix market requirements. We are excited to take these next steps in the region.”
About Fuji Corporation
Fuji Corporation is a market-leading supplier of surface mount technology (SMT) pick & place solutions, and has designed and manufactured many ground-breaking innovations in the circuit board assembly world. Fuji also offers a range of mounting machines, solder printers and production software that can easily integrate into a myriad of manufacturing environments to ensure that equipment runs competitively at all times. Service, training and support are provided by Fuji’s Global network of subsidiaries and official partners. Fuji Corporation’s North American Headquarters is located in Vernon Hills, IL, (near Chicago) as well as other North American regional offices and support centers in Fremont, CA, Guadalajara and Queretaro MX, and Ontario CN. Visit www.fujiamerica.com, for further information on our comprehensive line of SMT product.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.