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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.

Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

08/24/2026 | Coherent
Coherent Corp. , a global leader in photonics, announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/18/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.

Book Excerpt: The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings, Chapter 4

08/06/2026 | Brian J. Chislea and Cody Schoener, PhD, Dow, Inc.
Sustainability and reliability in electronics mean efficient manufacturing and durable devices that reduce waste and the need for frequent replacements. Choosing energy-efficient, low-solvent, fast-processing materials supports these goals. Case studies are presented in Chapter 4 of "The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings" that evaluate costs, energy use, materials, space, time, and overall savings.
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