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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Building Consistent Reflow Results Across Automotive Manufacturing Sites

10/20/2026 | Miles Moreau, KIC
As automotive electronics production shifts among global locations, replicating a successful assembly process isn’t as simple as moving the equipment or copying a recipe. Miles Moreau of KIC talks with Nolan Johnson about the challenges of maintaining consistent reflow performance across different lines and facilities. They explore what manufacturers can learn from better process data, where optimization can make a difference, and why experienced engineers still play a critical role in getting the process right.

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

Aismalibar to Showcase Advanced Thermal Management Materials at The Battery Show North America 2026

10/07/2026 | Aismalibar
Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show North America 2026, taking place October 12–15 at Huntington Place in Detroit, Michigan.

Aismalibar North America to Showcase Advanced Thermal Management Materials at PCB West 2026

09/29/2026 | Aismalibar
Aismalibar North America will showcase advanced thermal interface materials, thermally conductive PCB materials and insulated metal substrates at PCB West 2026 on Wednesday, September 30, at the Santa Clara Convention Center in Santa Clara, California.

Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.
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