Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
September 18, 2025 | AismalibarEstimated reading time: 1 minute
Aismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
Featured Innovations
- COBRITHERM ALP – A thermally conductive/dielectric aluminum substrate combining high dielectric strength (up to 10 kV) with superior thermal conductivity (2.2–3.2 W/mK). Ideal for EV batteries, telecom, and high-voltage systems, it reduces assembly time and cost while supporting automated PCB assembly.
- THIN LAM – Thermal FR4 for Multilayer PCBs – Optimized for SiC and GaN devices, THIN LAM lowers device temperatures by ~20°C compared to standard FR4, delivers >7% higher power throughput, and eliminates the need for thermal vias, improving reliability and simplifying PCB design.
- AirGapFiller for better heat flow in Electronic Power Modules – A surface-adaptive coating that fills microscopic voids at just 35–40°C to improve thermal contact, reduce resistance, and enhance heat dissipation in electronic power modules.
- Bond Sheet Cured (Glass-Free) – A high-performance insulation and thermal transmission material offering dielectric strength up to 10 kV, thermal conductivity up to 3.2 W/mK, and ultra-low thermal resistance (as low as 0.031 K/W). Clean, flexible, and fiber-free, it ensures long-term stability in demanding EV and industrial applications.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
10/28/2025 | John Watson -- Column: Elementary, Mr. WatsonIf electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.
Small Material, Big Impact: IDTechEx Explores Graphene in Electronic Applications
10/27/2025 | IDTechExGraphene was initially celebrated as a sci-fi material destined to transform electronics, quantum devices, and futuristic sensors. While expectations soared, commercial reality proved more modest.
Peters Spotlights Heatsink Paste at productronica
10/22/2025 | PetersThe ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in