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Suggested Items

Carano and ElectronicsU Debut New Course on Advanced Packaging

08/13/2026 | Nolan Johnson, I-Connect007
Mike Carano is an industry pioneer with deep expertise across multiple domains. In his latest course for the Global Electronics Association’s ElectronicsU platform, “Advanced Packaging: HDI Enabling Technology,” Carano delivers some of the first educational material introducing advanced packaging to the printed circuit supply chain. In this interview, he discusses the course content, target audience, and motivation for creating the course. 

Learning With Leo: Where Reliability Actually Hides

08/05/2026 | Leo Lambert -- Column: Learning With Leo
In my many years of training, it’s funny to see what still surprises people. For example, they’re surprised that by the time the solder melts, most of what decides whether that joint survives has already happened before the iron and even before inspection. In fact, it’s even earlier than that. In my column last month, I argued that most soldering problems are really problems of interpretation, which leads to the materials themselves, and where reliability is won or lost. So, let’s talk about what we’re actually soldering today.

Keeping Electronic Component Recovery and Reuse Closer to Home

07/29/2026 | Rob Ronan, Retronix Ltd.
Over the past several years, electronics manufacturers have been forced to rethink what supply chain resilience really means. Shortages, extended lead times, allocation pressures, obsolescence, and price volatility have exposed the limits of a procurement strategy built on the assumption that new components will always be available when needed. However, even when parts can be sourced, they may come with unacceptable lead times, inflated spot-market pricing, or concerns around authenticity and traceability.

SMT Perspectives & Prospects: The Architecture of Winston Churchill’s Leadership

07/24/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
I was recently invited to visit the U.S. Embassy and the Churchill War Rooms in London, where I met Warren Stephens, U.S. ambassador to the UK, and Bank of England Gov. Andrew Bailey. From those modern diplomatic corridors to the stark resolve of a wartime bunker, the experience reminded me that leadership in this ever-shifting global landscape is, at its best, about bridging the wisdom of the past with the realities of the present.

Interlocking Material Management and Quality

07/01/2026 | Nolan Johnson, SMT007 Magazine
Cogiscan’s Greg Benoit recently published a white paper series on material tracking in the EMS sector, in which he argues that achieving a fully integrated MES infrastructure requires more than a software package to make the system work at its best. In this interview, Greg discusses the white paper series in more depth. You can download the two-part Cogiscan white paper, Strategies for Efficient Material Management in Circuit Board Assembly, from our Industry Resource Center.